DARPA selects BAE Systems to build powerful next-generation advanced electronics

BAE Systems was awarded a contract from the Defense Advanced Research Projects Agency (DARPA) to develop the next generation of mixed-signal electronics that could enable new Department of Defense (DoD) applications including high capacity, robust communications, radars, and precision sensors, and lead to solutions that enhance situational awareness and survivability for the warfighter.
Recognizing that the DoD has performance demands that far exceed the capabilities of the commercial world in terms of speed, fidelity, capacity, and precision, DARPA created the Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC) program to enable disruptive radio frequency (RF) mixed-mode technologies by developing high-performance RF analog electronics integrated with advanced digital electronics on the same wafer (Picture source: BAE Systems)

Related Posts

There is no other posts in this category.
Subscribe Our Newsletter